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Wafers (17)
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1st Silicon http://www.1stsilicon.com
Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC.
ACI Group http://www.acigp.com
Offers turnkey contract manufacturing, logistics and testing services.
Advanced Thin Film Technology http://www.thinfilm-coating.com
Provides high quality thin film coatings, patterned substrates, hybrid and resistor networks.
ASE Korea, Inc. http://www.asekr.com
Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
Catalyst Microtech LLC http://www.catalystmicrotech.com/
Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form.
Chartered Semiconductor Manufacturing http://www.charteredsemi.com/
Dedicated integrated circuit (IC) wafer foundry
Cirtek Electronics Corporation http://www.cirtek-electronics.com/
An independent subcontractor for semiconductor assembly, test and packaging services.
DALSA Semiconductor http://www.dalsasemi.com/
Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions.
Dolphin Technology Inc. http://www.dolphin-ic.com
Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
Eltek Semiconductors Ltd http://www.eltek-semi.com
Procuring and processing semiconductor components in wafer, die and packaged form.
First Level Inc. http://www.firstlevelinc.com/
Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
Honeywell Electronic Materials http://www.electronicmaterials.com
Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Product and technology briefs, and a description of company's manufacturing cleanroom.
http://pagesperso-orange.fr/inpact/ http://pagesperso-orange.fr/inpact/
Providing wafering and polishing services of high performance semiconductors and industrial crystals.
http://www.ame.no http://www.ame.no
Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing.
http://www.amitec.com/ http://www.amitec.com/
Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations.
http://www.incide-semi.com http://www.incide-semi.com
A fabless design house focused on RF and high-speed digital integrated designs.
http://www.viasic.com/ http://www.viasic.com/
Company offering low NRE one mask architecture and software solutions to the ASIC community. Aimed at FPGA conversion and ASIC replacement markets.
Jade Precision Engineering Pte Ltd http://www.jade.com.sg/
Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
PolarFab http://www.polarfab.com
Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
Prema Semiconductor http://www.prema.com/
Fabricates analog and mixed-signal ICs
Premier Semiconductor Services http://www.premiers2.com/
Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
Prologue Technology Inc. http://www.prologuetech.com
Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto.
Promex Industries Inc. http://www.promex-ind.com
Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
Protochips Inc. http://www.protochips.com/
Offers custom layout and fabrication services for emerging companies and university groups.
Reltech Limited http://www.reltech.co.uk/
European supplier of advanced semiconductor burn-in and reliability test systems.
Satcon Electronics http://www.satconelectronics.com/
Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
Sigurd Microelectronics Corporation http://www.sigurd.com.tw/
Provides semiconductor IC assembly and testing services.
Silicon Infusion Limited http://www.siliconinfusion.com/
Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
Silterra Malaysia Sdn Bhd http://www.silterra.com/
Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
Tower Semiconductor LTD. http://www.towersemi.com
Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
Trikon Technologies http://www.trikon.com/
Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment.
Valtronic http://www.valtronic.ch
Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Include capabilities, and illustrated discussions of packaging technologies and processes.
WaferTech http://www.wafertech.com
Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.

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