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Chartered Semiconductor Manufacturing - http://www.charteredsemi.com/
Dedicated integrated circuit (IC) wafer foundry |
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DALSA Semiconductor - http://www.dalsasemi.com/
Open foundry offering specialty wafer fabrication for MEMS, high voltage CMOS, analog and mixed signal CMOS, and CCDs with experience in telecom, telephony, and optical networking chips. Company overview, facilities and manufacturing process descriptions. |
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1st Silicon - http://www.1stsilicon.com
Semiconductor foundry founded in 1998 by the Malaysian State of Sarawak. 0.18 and 0.25 micron CMOS and mixed signal CMOS IC. |
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Tower Semiconductor LTD. - http://www.towersemi.com
Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel. |
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Valtronic - http://www.valtronic.ch
Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Include capabilities, and illustrated discussions of packaging technologies and processes. |
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Honeywell Electronic Materials - http://www.electronicmaterials.com
Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Product and technology briefs, and a description of company's manufacturing cleanroom. |
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Protochips Inc. - http://www.protochips.com/
Offers custom layout and fabrication services for emerging companies and university groups. |
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http://www.viasic.com/ - http://www.viasic.com/
Company offering low NRE one mask architecture and software solutions to the ASIC community. Aimed at FPGA conversion and ASIC replacement markets. |
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WaferTech - http://www.wafertech.com
Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA. |
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Silterra Malaysia Sdn Bhd - http://www.silterra.com/
Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia. |
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http://www.ame.no - http://www.ame.no
Custom and standard silicon photodetectors and thick and thin film optoelectronic devices, offering wafer fabrication, bonding and packaging, and testing. |
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Trikon Technologies - http://www.trikon.com/
Semiconductor manufacturer utilizing plasma etch, PVD (physical vapour deposition) and CVD (chemical vapour deposition) equipment. |
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PolarFab - http://www.polarfab.com
Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA. |
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Promex Industries Inc. - http://www.promex-ind.com
Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China. |
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ASE Korea, Inc. - http://www.asekr.com
Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF. |
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Prema Semiconductor - http://www.prema.com/
Fabricates analog and mixed-signal ICs |
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Sigurd Microelectronics Corporation - http://www.sigurd.com.tw/
Provides semiconductor IC assembly and testing services. |
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Dolphin Technology Inc. - http://www.dolphin-ic.com
Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks. |
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Satcon Electronics - http://www.satconelectronics.com/
Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities. |
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http://www.incide-semi.com - http://www.incide-semi.com
A fabless design house focused on RF and high-speed digital integrated designs. |
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ACI Group - http://www.acigp.com
Offers turnkey contract manufacturing, logistics and testing services. |
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Premier Semiconductor Services - http://www.premiers2.com/
Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking. |
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Eltek Semiconductors Ltd - http://www.eltek-semi.com
Procuring and processing semiconductor components in wafer, die and packaged form. |
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http://www.amitec.com/ - http://www.amitec.com/
Provides high density interconnect (HDI) substrates and flip chip semiconductor BGA packaging for single or multichip (MCM) modules. Packaging description, technical notes, and company presentations. |
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Prologue Technology Inc. - http://www.prologuetech.com
Manufacturer representative for semiconductor design and manufacturing. Based in Markham, Ontario, Canada, serving primarily Canada, Central and Eastern US. Close proximity to the Lester B. Pearson Airport in Toronto. |
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Silicon Infusion Limited - http://www.siliconinfusion.com/
Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards. |
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Cirtek Electronics Corporation - http://www.cirtek-electronics.com/
An independent subcontractor for semiconductor assembly, test and packaging services. |
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Jade Precision Engineering Pte Ltd - http://www.jade.com.sg/
Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products. |
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First Level Inc. - http://www.firstlevelinc.com/
Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip. |
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Catalyst Microtech LLC - http://www.catalystmicrotech.com/
Semiconductor assembly and packaging services, including quick turn and turn key projects for mil-std, BGA, folded flex, and multichip packages. List of services and factory equipment and quotation form. |